Permanent URL to this publication: http://dx.doi.org/10.5167/uzh-9417
Miyashita, S; Casanova, F; Lungarella, M; Pfeifer, R (2008). Peltier-based freeze-thaw connector for waterborne self-assembly systems. In: IEEE/RSJ International Conference on Intelligent Robots and Systems (IROS 2008), Nice, France, 22 September 2008 - 26 September 2008, 1325-1330.
|PDF (Original publication)|
We present a novel type of inter-module connection
mechanism for waterborne modular robotic systems. The
proposed mechanism exploits the thermoelectric effect to cool down and freeze the water between two modules thus causes them to attach to each other. We validate the feasibility of this mechanism by embedding a Peltier heat pump (m = 0.8 g) in two types of cm scale self-assembly systems, one in which the modules are free to move and one in which the modules are linked together by hinges. Our experimental results demonstrate that the proposed Peltier-based connector has (a) a high bond strength/weight ratio for a rather large range of temperatures and (b) is rather robust against misalignments between docking modules, making it a useful alternative to current connection mechanisms for small scale low autonomy self-assembly systems.
|Item Type:||Conference or Workshop Item (Paper), refereed, original work|
|Communities & Collections:||03 Faculty of Economics > Department of Informatics|
|DDC:||000 Computer science, knowledge & systems|
|Event End Date:||26 September 2008|
|Deposited On:||12 Jan 2009 16:54|
|Last Modified:||27 Nov 2013 21:54|
|Additional Information:||This paper was presented at the IEEE/RSJ International Conference on Intelligent Robots and Systems (IROS 2008), Nice, France, September 22 - 26, 2008. © 2008 IEEE. Personal use of this material is permitted. However, permission to reprint/republish this material for advertising or promotional purposes or for creating new collective works for resale or redistribution to servers or lists, or to reuse any copyrighted component of this work in other works must be obtained from the IEEE.|
|Citations:||Web of Science®. Times cited: 4|
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