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Mapping Spiking Neural Networks to Neuromorphic Hardware

Balaji, Adarsha; Catthoor, Francky; Das, Anup; Wu, Yuefeng; Huynh, Khanh; Dell'Anna, Francesco G; Indiveri, Giacomo; Krichmar, Jeffrey L; Dutt, Nikil D; Schaafsma, Siebren (2020). Mapping Spiking Neural Networks to Neuromorphic Hardware. IEEE Transactions on Very Large Scale Integration (VLSI) Systems, 28(1):76-86.

Abstract

Neuromorphic hardware implements biological neurons and synapses to execute a spiking neural network (SNN)-based machine learning. We present SpiNeMap, a design methodology to map SNNs to crossbar-based neuromorphic hardware, minimizing spike latency and energy consumption. SpiNeMap operates in two steps: SpiNeCluster and SpiNePlacer. SpiNeCluster is a heuristic-based clustering technique to partition an SNN into clusters of synapses, where intracluster local synapses are mapped within crossbars of the hardware and intercluster global synapses are mapped to the shared interconnect. SpiNeCluster minimizes the number of spikes on global synapses, which reduces spike congestion and improves application performance. SpiNePlacer then finds the best placement of local and global synapses on the hardware using a metaheuristic-based approach to minimize energy consumption and spike latency. We evaluate SpiNeMap using synthetic and realistic SNNs on a state-of-the-art neuromorphic hardware. We show that SpiNeMap reduces average energy consumption by 45% and spike latency by 21%, compared to the best-performing SNN mapping technique.

Additional indexing

Item Type:Journal Article, refereed, original work
Communities & Collections:07 Faculty of Science > Institute of Neuroinformatics
Dewey Decimal Classification:570 Life sciences; biology
Scopus Subject Areas:Physical Sciences > Software
Physical Sciences > Hardware and Architecture
Physical Sciences > Electrical and Electronic Engineering
Uncontrolled Keywords:Hardware and Architecture, Electrical and Electronic Engineering, Software
Language:English
Date:1 January 2020
Deposited On:14 Feb 2020 09:50
Last Modified:22 Jan 2025 02:42
Publisher:Institute of Electrical and Electronics Engineers
ISSN:1063-8210
OA Status:Closed
Publisher DOI:https://doi.org/10.1109/tvlsi.2019.2951493

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